Characterization of Integrated Circuit Packaging Materials by Robert McKenna 0000-00-00 00:00:00

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by Robert McKenna
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Characterization of Integrated Circuit Packaging Materials by Robert McKenna
Author
Robert McKenna
Publisher
Momentum Press
Date of release
Pages
274
ISBN
9781606501870
Binding
Hardcover
Illustrations
Format
PDF, EPUB, MOBI, TXT, DOC
Rating
5
42
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Book review

With a particular emphasis on fabrication quality control, this volume in the Materials Characterization series focuses on characterization techniques used for critical junctures in package design like mold compound adhesion and strength, mechanical stres

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